Product parameter details

PRODUCT DETAILS

Point Components type PCB size
246 70 130mm*110mm
RLC Minimum Package Size Minimum device pin spacing Welding mode
0402 0.65 Reflow soldering for double
sides+ Wave soldering
Manufacturing process
PCB producing+components procurement+assembly
Point Components type PCB size
246 70 130mm*110mm
RLC Minimum Package Size Minimum device pin spacing Welding mode
0402 0.65 Reflow soldering for double
sides+ Wave soldering
Manufacturing process
PCB producing+components procurement+assembly
Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.0±0.1mm Laser hole: 0.10mm,
Mechanical hole 0.15mm 100/100um S221021G10 Surface finish Hard gold 2U and increase hard gold selective 50 U